Patent Assignment Details
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| Reel/Frame: | 011954/0448 | |
| Pages: | 2 |
| | Recorded: | 06/29/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09894127
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Filing Dt:
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06/29/2001
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Publication #:
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Pub Dt:
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01/10/2002
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Title:
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SEMICONDUCTOR WAFER GRINDING METHOD
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Assignee
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| 14-3, HIGASHI KOJIYA 2-CHOME |
| OTA-KU, TOKYO 144-8650, JAPAN |
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Correspondence name and address
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SMITH, GAMBRELL & RUSSELL, LLP
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MICHAEL A. MAKUCH
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1850 M STREET, N.W., SUITE 800
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WASHINGTON, DC 20036
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