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Patent Assignment Details

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Reel/Frame:	012035/0896			Pages:	5
		Recorded:	08/02/2001
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 1

Patent #:	6632335	Issue Dt:	10/14/2003	Application #:	09742110	Filing Dt:	12/22/2000
Publication #:	US20020020627	Pub Dt:	02/21/2002
Title:	PLATING APPARATUS

Assignors

KUNISAWA, JUNJI

Exec Dt:

03/01/2001

ODAGAKI, MITSUKO

Exec Dt:

03/01/2001

MAKINO, NATSUKI

Exec Dt:

03/01/2001

MISHIMA, KOJI

Exec Dt:

03/01/2001

NAKAMURA, KENJI

Exec Dt:

03/01/2001

INOUE, HIROAKI

Exec Dt:

03/01/2001

KIMURA, NORIO

Exec Dt:

03/01/2001

MATSUDA, TETSUO

Exec Dt:

03/01/2001

KANEKO, HISASHI

Exec Dt:

03/01/2001

HAYASAKA, NOBUO

Exec Dt:

03/01/2001

OKUMURA, KATSUYA

Exec Dt:

03/01/2001

TSUJIMURA, MANABU

Exec Dt:

03/01/2001

MORITA, TOSHIYUKI

Exec Dt:

03/01/2001

Assignees

EBARA CORPORATION

11-1, HANEDA ASAHI-CHO, OHTA-KU

TOKYO, JAPAN

KABUSHIKI KAISHA TOSHIBA

72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI

KANAGAWA-KEN, JAPAN

Correspondence name and address
	WENDEROTH, LIND & PONACK, L.L.P.
	ATTN: NILS E. PEDERSEN, ESQ.
	2033 K STREET, N.W., SUITE 800
	WASHINGTON, DC 20006-1021

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