Patent Assignment Details
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| Reel/Frame: | 012081/0767 | |
| Pages: | 3 |
| | Recorded: | 08/17/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09878341
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Filing Dt:
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06/12/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Title:
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AG-PRE-PLATED LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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Assignees
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| 28 SUNGJU-DONG, CHANGWON-CITY |
| KYONGSANGNAM-DO, KOREA, REPUBLIC OF |
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| 416 MAETAN-DONG, PALDAL-GU |
| SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL
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MR. ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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