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Reel/Frame:012106/0366   Pages: 3
Recorded: 05/07/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/05/2002
Application #:
09761958
Filing Dt:
01/17/2001
Publication #:
Pub Dt:
12/06/2001
Title:
SEMICONDUCTOR WAFER, METHOD FOR PROCESSING THE SAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
04/10/2001
Assignee
1
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN
Correspondence name and address
HARNESS, DICKEY & PIERCE, P.L.C.
G. GREGORY SCHIVLEY
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303

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