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Patent Assignment Details
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Reel/Frame:012163/0549   Pages: 3
Recorded: 09/05/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/31/2006
Application #:
09947098
Filing Dt:
09/05/2001
Publication #:
Pub Dt:
03/13/2003
Title:
ELECTRONIC PACKAGE HAVING A THERMAL STRETCHING LAYER
Assignors
1
Exec Dt:
08/10/2001
2
Exec Dt:
08/13/2001
3
Exec Dt:
08/10/2001
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORPORATION
LAWRENCE R. FRALEY
1701 NORTH STREET
IP LAW DEPT. N50/040-4
ENDICOTT, NY 13760

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