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Reel/Frame:012217/0790   Pages: 4
Recorded: 10/01/2001
Conveyance: CORRECTIVE ASSIGNMENT TO INSERT AN ADDITIONAL ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL 01036 FRAME 0182.
Total properties: 1
1
Patent #:
Issue Dt:
03/26/2002
Application #:
09381765
Filing Dt:
09/23/1999
Title:
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING IT, AND SEMICONDUCTOR SEALING RESIN COMPOSITION
Assignors
1
Exec Dt:
09/02/1999
2
Exec Dt:
09/02/1999
3
Exec Dt:
09/02/1999
4
Exec Dt:
09/02/1999
Assignees
1
2-1 NIHONBASHI-MUROMACHI 2-CHOME
CHUO-KU, TOKYO 103-8666, JAPAN
2
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Correspondence name and address
SCHNADER HARRISON SEGAL & LEWIS
T. DANIEL CHRISTENBURY
1600 MARKET STREET, 36TH FLOOR
PHILADELPHIA, PA 19103

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