Patent Assignment Details
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| Reel/Frame: | 012249/0565 | |
| Pages: | 3 |
| | Recorded: | 10/10/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/04/2003
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Application #:
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09974192
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Filing Dt:
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10/10/2001
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Title:
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PACKAGED STACKED SEMICONDUCTOR DIE AND METHOD OF PREPARING SAME
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Assignee
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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WILLIAMS, MORGAN & AMERSON, P.C.
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DANNY L. WILLIAMS
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7676 HILLMONT, SUITE 250
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HOUSTON, TX 77040
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05/09/2024 09:41 PM
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