Patent Assignment Details
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| Reel/Frame: | 012249/0737 | |
| Pages: | 4 |
| | Recorded: | 10/11/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09866641
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Filing Dt:
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05/30/2001
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Publication #:
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Pub Dt:
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11/15/2001
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Title:
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CENTER BOND FLIP-CHIP SEMICONDUCTOR DEVICE AND METHOD OF MAKING IT
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Assignee
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN ET AL
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THOMAS J. D'AMICO
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2101 L STREET NW
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WASHINGTON, DC 20037-1526
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