Patent Assignment Details
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Reel/Frame: | 012316/0846 | |
| Pages: | 4 |
| | Recorded: | 11/21/2001 | | |
Conveyance: | REQUEST FOR CORRECTED RECORDATION REEL NO. 011899 AND FRAME 0296. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/05/2003
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Application #:
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09879082
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Filing Dt:
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06/13/2001
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Publication #:
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Pub Dt:
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08/15/2002
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Title:
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LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
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Assignee
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1006, OAZA KADOMA KADOMA-SHI |
OSAKA, JAPAN 571-8 |
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Correspondence name and address
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NIXON PEABODY LLP
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ERIC J. ROBINSON
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8180 GREENSBORO DRIVE
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SUITE 800
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MCLEAN, VA 22102
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