Patent Assignment Details
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| Reel/Frame: | 012336/0325 | |
| Pages: | 2 |
| | Recorded: | 11/30/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/2004
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Application #:
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09996802
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Filing Dt:
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11/30/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Title:
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RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM
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Assignee
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU, |
| TOKYO 141-8584, JAPAN |
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Correspondence name and address
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ARENT FOX KINTNER PLOTKIN & KAHN PLLC
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ROBERT B. MURRAY
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1050 CONNECTICUT AVENUE, N.W., SUITE 400
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WASHINGTON D.C. 20036-5339
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