Patent Assignment Details
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| Reel/Frame: | 012354/0822 | |
| Pages: | 2 |
| | Recorded: | 10/31/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/22/2003
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Application #:
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10002022
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Filing Dt:
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10/31/2001
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Title:
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THERMALLY ENHANCED SEMICONDUCTOR CHIP HAVING INTEGRATED BONDS OVER ACTIVE CIRCUITS
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Assignee
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| P.O. BOX 655474 MS 3999 |
| DALLAS, TEXAS 75265 |
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Correspondence name and address
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GODWIN, GRUBER, P.C.
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GARY C. HONEYCUTT
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801 E. CAMPBELL ROAD
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SUITE 655
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RICHARDSON, TX 75081
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