Patent Assignment Details
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Reel/Frame: | 012447/0376 | |
| Pages: | 6 |
| | Recorded: | 01/10/2002 | | |
Conveyance: | CORRECTED RECORDATION FORM COVER SHEET TO CORRECT STATE OF INCORPORATION, PREVIOUSLY RECORDED AT REEL/FRAME 010128/0117 (ASSIGNMENT OF ASSIGNOR'S INTEREST) |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09359074
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Filing Dt:
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07/22/1999
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Title:
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TECHNIQUES FOR WAFER LEVEL MOLDING OF UNDERFILL ENCAPSULANT
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER WEAVER & THOMAS LLP
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STEVE D. BEYER
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PO BOX 778
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BERKELEY, CA 94704-0778
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