Patent Assignment Details
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| Reel/Frame: | 012461/0001 | |
| Pages: | 5 |
| | Recorded: | 01/09/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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10/01/1991
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Application #:
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07290652
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Filing Dt:
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12/23/1988
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Title:
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THICK FILM INK COMPOSITION
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Patent #:
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Issue Dt:
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12/08/1992
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Application #:
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07646266
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Filing Dt:
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01/28/1991
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Title:
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THICK-FILM CIRCUIT ELEMENT ON A CERAMIC SUBSTRATE
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Patent #:
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Issue Dt:
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12/30/1997
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Application #:
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08500547
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Filing Dt:
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07/11/1995
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Title:
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THICK-FILM CIRCUIT ELEMENT
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Patent #:
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Issue Dt:
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07/29/1997
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Application #:
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08651833
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Filing Dt:
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05/21/1996
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Title:
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THERMALLY FUSED RESISTOR HAVING A PORTION OF A SOLDER LOOP THERMALLY CONNECTED TO AN ELECTRICALLY INSULATED PORTION OF AN OUTER SURFACE OF THE RESISTOR
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Assignee
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| 1375 SWAN STREET |
| HUNTINGTON, INDIANA 46750 |
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Correspondence name and address
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WOODARD EMHARDT NAUGHTON MORIARTY &
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MCNETT - BRAD A. SCHEPERS
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111 MONUMENT CIRCLE, SUITE 3700
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BANK ONE CENTER/TOWER
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INDIANAPOLIS, IN 46204-5137
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