Patent Assignment Details
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| Reel/Frame: | 012461/0477 | |
| Pages: | 3 |
| | Recorded: | 01/08/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/04/2003
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Application #:
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10038901
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Filing Dt:
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01/08/2002
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Publication #:
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Pub Dt:
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01/02/2003
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Title:
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METHOD FOR MANUFACTURING A RESIN-SEALED SEMICONDUCTOR DEVICE
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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Correspondence name and address
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NIXON PEABODY LLP
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ERIC J. ROBINSON
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8180 GREENBORO DRIVE, SUITE 800
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MCLEAN, VIRGINIA 22102
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04/28/2024 03:55 PM
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