Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 012530/0708 | |
| Pages: | 2 |
| | Recorded: | 02/01/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08792394
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Filing Dt:
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02/03/1997
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Title:
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MOLD PACKAGE FOR SEALING A CHIP
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Patent #:
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Issue Dt:
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09/21/1999
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Application #:
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08808420
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Filing Dt:
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02/28/1997
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Title:
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LEAD FRAME FLASH REMOVING METHOD AND APPARATUS
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08824459
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Filing Dt:
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03/26/1997
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Title:
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HOLLOW PACKAGE MANUFACTURING METHOD
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Assignee
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1753, SHIMONUMABE, NAKAHARA-KU |
KAWASAKI-KANAGAWA 211-8666, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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J. FRANK OSHA
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, D.C. 20037-3213
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