Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 012532/0663 | |
| Pages: | 3 |
| | Recorded: | 01/22/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/12/2015
|
Application #:
|
10055568
|
Filing Dt:
|
01/22/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/03/2003
| | | | |
|
Title:
|
CHIP PACKAGE WITH DIE AND SUBSTRATE
|
|
|
Assignee
|
|
|
|
|
| 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCU, TAIWAN R.O.C |
|
|
Correspondence name and address
|
| |
J.C. PATENTS, INC.
|
| |
JIAWEI HUANG
|
| |
4 VENTURE, SUITE 250
|
| |
IRVINE, CA 92618
|
Search Results as of:
05/16/2024 07:38 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
