Patent Assignment Details
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Reel/Frame: | 012608/0365 | |
| Pages: | 2 |
| | Recorded: | 02/14/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/10/2002
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Application #:
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09659969
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Filing Dt:
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09/12/2000
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Title:
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MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND WAFER BLOCK CONTACT BOARD
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Assignee
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7-5, NAKA-OCHIAI 2-CHOME, SHINJUKU-KU |
TOKYO, JAPAN |
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Correspondence name and address
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COOK, ALEX, MCFARRON, MANZO, ET AL
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EDWARD D. MANZO, ESQ.
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200 WEST ADAMS STREET, SUITE 2850
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CHICAGO, IL 60606
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