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Patent Assignment Details
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Reel/Frame:012620/0453   Pages: 6
Recorded: 02/27/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10013822
Filing Dt:
12/13/2001
Publication #:
Pub Dt:
09/05/2002
Title:
Solder coated lid
Assignors
1
Exec Dt:
02/06/2002
2
Exec Dt:
02/04/2002
3
Exec Dt:
02/04/2002
4
Exec Dt:
02/04/2002
Assignees
1
23 SENJU-HASHIDO-CHO
ADACHI-KU, TOKYO, JAPAN
2
2701-1 AZA-IWAKURA, HIGASHIBUN, OMINE-CHO
MINE-SHI, YAMAGUCHI, JAPAN
Correspondence name and address
MICHAEL TOBIAS
1730 K STREET, N.W.
SUITE 304
WASHINGTON, DC 20006

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