Patent Assignment Details
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| Reel/Frame: | 012638/0228 | |
| Pages: | 2 |
| | Recorded: | 02/22/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10080468
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Filing Dt:
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02/22/2002
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Publication #:
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Pub Dt:
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08/28/2003
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Title:
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HDP CVD process for void-free gap fill of a high aspect ratio trench
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Assignee
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| SCIENCE BASED INDUSTRIAL PARK |
| NO. 19 LI HSIN ROAD |
| HSIN CHU CITY, TAIWAN |
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Correspondence name and address
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SKJERVEN MORRILL MACPHERSON LLP
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ALAN H. MACPHERSON
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25 METRO DRIVE
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SUITE 700
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SAN JOSE, CA 95110
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