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Patent Assignment Details
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Reel/Frame:012643/0204   Pages: 3
Recorded: 03/01/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/27/2004
Application #:
10084923
Filing Dt:
03/01/2002
Publication #:
Pub Dt:
03/06/2003
Title:
THIN-FILM CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND A VIA FORMED SUBSTRATE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
02/19/2002
2
Exec Dt:
02/19/2002
3
Exec Dt:
02/19/2002
4
Exec Dt:
02/19/2002
5
Exec Dt:
02/19/2002
Assignee
1
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Correspondence name and address
ARMSTRONG, WESTERMAN & HATTORI, LLP
DONALD W. HANSON
1725 K STREET, N.W., SUITE 1000
WASHINGTON, DC 20006

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