Patent Assignment Details
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| Reel/Frame: | 012645/0035 | |
| Pages: | 3 |
| | Recorded: | 02/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/23/2003
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Application #:
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10078948
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Filing Dt:
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02/19/2002
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Publication #:
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Pub Dt:
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08/21/2003
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Title:
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SACRIFICIAL SEED LAYER PROCESS FOR FORMING C4 SOLDER BUMPS
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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GRAHAM S. JONES, II
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42 BARNARD AVENUE
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POUGHKEEPSIE, NY 12601-5023
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