Patent Assignment Details
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| Reel/Frame: | 012655/0556 | |
| Pages: | 3 |
| | Recorded: | 02/27/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2004
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Application #:
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10024827
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Filing Dt:
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12/17/2001
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Publication #:
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Pub Dt:
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06/27/2002
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Title:
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LEAD FRAME FOR A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE MADE FROM THE LEAD FRAME, AND A METHOD OF MAKING A SEMICONDUCTOR DEVICE
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Assignee
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| YAHATANISHI-KU, KITAKYUSHU-SHI |
| 10-1, KOMINE 2-CHOME |
| FUKUOKA 806-8588, JAPAN |
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Correspondence name and address
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WOOD, PHILLIPS, VANSANTEN, CLARK ET AL
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JOHN S. MORTIMER
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500 WEST MADISON STREET
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SUITE 3800
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CHICAGO, IL 60661
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