Patent Assignment Details
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| Reel/Frame: | 012691/0364 | |
| Pages: | 2 |
| | Recorded: | 03/12/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/26/1995
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Application #:
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08190254
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Filing Dt:
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02/01/1994
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Title:
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FUSED CHIP-TYPE SOLID ELECTROLYTIC CAPACITOR AND FABRICATION METHOD THEREOF
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Assignee
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| 560, NYUZEN, NYUZEN-MACHI, SHIMONIIKAWA-GUN |
| TOYAMA 939-0626, JAPAN |
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Correspondence name and address
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MICHAEL BEST & FRIEDRICH LLC
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J. WARREN WHITESEL
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401 N. MICHIGAN AVE.
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STE. 1700
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CHICAGO, IL 60611-4274
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