Patent Assignment Details
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| Reel/Frame: | 012708/0837 | |
| Pages: | 2 |
| | Recorded: | 03/18/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09984974
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Filing Dt:
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10/31/2001
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Publication #:
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Pub Dt:
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07/11/2002
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Title:
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Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material
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Assignees
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| CHIYODA-KU, |
| 6, KANDA SURUGADAI 4-CHOME, |
| TOKYO,, JAPAN |
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| 1-CHOME, CHIYODA-KU, |
| 601, OHTE MACHI, |
| TOKYO,, JAPAN |
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Correspondence name and address
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CROWELL & MORING, L.L.P.
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P.O. BOX 14300
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WASHINGTON, DC 20004-4300
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