Patent Assignment Details
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| Reel/Frame: | 012725/0519 | |
| Pages: | 2 |
| | Recorded: | 01/22/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10031461
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Filing Dt:
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01/22/2002
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Publication #:
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Pub Dt:
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03/13/2003
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Title:
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Automatic analyzing/controlling device for electroless composite plating solution
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Assignee
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| CHUO-KU, OSAKA-SHI |
| 2-6, DOSHO-MACHI 3-CHOME |
| OSAKA 541-0045, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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NEIL B. SIEGEL
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2100 PENNSYLVANIA AVE., N.W.
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STE. 800
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WASHINGTON, D.C. 20037-3213
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