Patent Assignment Details
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Reel/Frame: | 012738/0799 | |
| Pages: | 2 |
| | Recorded: | 03/22/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10104975
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Filing Dt:
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03/22/2002
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Publication #:
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Pub Dt:
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12/05/2002
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Title:
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Lamination method of embedding passive components in an organic circuit board
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 6, LI-HSIN PARK |
HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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RAYMOND SUN
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12420 WOODHALL WAY
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TUSTIN, CALIFORNIA 92782
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05/01/2024 02:47 AM
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