Patent Assignment Details
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| Reel/Frame: | 012798/0885 | |
| Pages: | 7 |
| | Recorded: | 04/11/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10122011
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Filing Dt:
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04/11/2002
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Publication #:
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Pub Dt:
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10/16/2003
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Title:
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Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
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Assignee
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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MARK V. SEELEY
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P.O. BOX 5326
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SC4-202
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SANTA CLARA, CA 95056-5326
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