Patent Assignment Details
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| Reel/Frame: | 012826/0021 | |
| Pages: | 3 |
| | Recorded: | 04/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/21/2004
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Application #:
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10125396
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Filing Dt:
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04/19/2002
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Publication #:
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Pub Dt:
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06/05/2003
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Title:
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RESIN-MOLDED SEMICONDUCTOR DEVICE
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Assignee
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| 7-12, TORANOMON 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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RABIN & BERDO, P.C.
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ROBERT H. BERDO, JR.
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1101 14TH STREET, N.W., SUITE 500
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WASHINGTON, DC 20005
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