Patent Assignment Details
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| Reel/Frame: | 012853/0080 | |
| Pages: | 3 |
| | Recorded: | 03/20/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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10088479
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Filing Dt:
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03/20/2002
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Publication #:
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Pub Dt:
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11/28/2002
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Title:
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FLIP CHIP PACKAGE, CIRCUIT BOARD THEREOF AND PACKAGING METHOD THEREOF
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Assignee
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| 1006, OAZA KADOMA KADOMA-SHI |
| OSAKA, JAPAN 571-8 |
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Correspondence name and address
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PARKHURST & WENDEL, L.L.P.
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ROGER W. PARKHURST
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1421 PRINCE STREET
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SUITE 210
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ALEXANDRIA, VA 22314-2805
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