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Reel/Frame:012869/0483   Pages: 7
Recorded: 05/01/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/09/2003
Application #:
10137790
Filing Dt:
05/01/2002
Publication #:
Pub Dt:
11/06/2003
Title:
PLATEN FOR ELECTROSTATIC WAFER CLAMPING APPARATUS
Assignors
1
Exec Dt:
04/17/2002
2
Exec Dt:
04/16/2002
3
Exec Dt:
04/17/2002
4
Exec Dt:
04/17/2002
5
Exec Dt:
04/17/2002
6
Exec Dt:
04/23/2002
7
Exec Dt:
04/16/2002
Assignees
1
ATSUTA-KU
2-4-1 MUTSUNO
NAGOYA, JAPAN 456-8
2
1-21-10 HIGASHI GOTANDA
SUMITOMO MARINE BLDG.
SHINAGAWA-KU, TOKYO, JAPAN 141-0
3
1-21-10 HIGASHI GOTANDA
11601 MAPLE RIDGE ROAD
MEDINA, NEW YORK 14103
Correspondence name and address
HODGSON RUSS LLP
MARTIN G. LINIHAN
ONE M&T PLAZA
SUITE 2000
BUFFALO, NY 14203-2391

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