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Patent Assignment Details
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Reel/Frame:012921/0660   Pages: 2
Recorded: 05/20/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10147903
Filing Dt:
05/20/2002
Publication #:
Pub Dt:
11/21/2002
Title:
Flip-chip-type semiconductor device and manufacturing method thereof
Assignor
1
Exec Dt:
05/08/2002
Assignee
1
MINATO-KU
7-1, SHIBA 5-CHOME
TOKYO, JAPAN
Correspondence name and address
YOUNG & THOMPSON
YOLANDA REYNOLDS
745 S. 23RD ST., 2ND FL.
ARLINGTON, VA 22202

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