Patent Assignment Details
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| Reel/Frame: | 012921/0768 | |
| Pages: | 7 |
| | Recorded: | 05/24/2002 | | |
| Conveyance: | MERGER/CHANGE OF NAME |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08485936
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Filing Dt:
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06/07/1995
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Title:
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COPPER OXIDE-FILLED POLYMER DIE ATTACH ADHESIVE COMPOSITION FOR SEMICONDUCTOR PACKAGE
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Assignees
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| 280-8, 2GA, SUNGSU-DONG, SUGDONG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN MORRILL LLP
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JAMES E. PARSONS
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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