Patent Assignment Details
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| Reel/Frame: | 012939/0131 | |
| Pages: | 3 |
| | Recorded: | 05/29/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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10128282
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Filing Dt:
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04/24/2002
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Publication #:
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Pub Dt:
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11/21/2002
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Title:
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POLISHING PAD FOR SEMICONDUCTOR WAFER AND LAMINATED BODY FOR POLISHING OF SEMICONDUCTOR WAFER EQUIPPED WITH THE SAME AS WELL AS METHOD FOR POLISHING OF SEMICONDUCTOR WAFER
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Assignee
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| 2-11-24, TSUKIJI, CHUO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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OBLON SPIVAK MCCLELLAND MAIER & NEUSTADT
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ROLAND E. MARTIN
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1755 JEFFERSON DAVIS HIGHWAY, FOURTH FL.
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ARLINGTON, VA 22202
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