Patent Assignment Details
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| Reel/Frame: | 012946/0955 | |
| Pages: | 5 |
| | Recorded: | 06/10/2002 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION OF ASSIGNMENT RECORDED AT REEL 012591 AND FRAME 0917 |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09336037
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Filing Dt:
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06/18/1999
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Title:
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METHOD AND APPARATUS FOR FORMING A PLASTIC CHIP ON CHIP PACKAGE MODULE
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Assignee
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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BEYER WEAVER & THOMAS LLP
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STEVE D. BEYER
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P.O. BOX 778
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BERKELEY, CA 94704-0778
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