Patent Assignment Details
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Reel/Frame: | 012951/0875 | |
| Pages: | 4 |
| | Recorded: | 06/03/2002 | | |
Conveyance: | RE-RECORD TO ADD OMITTED SECOND ASSGINEE, PREVIOUSLY RECORDED AT REEL 012667, FRAME 0706. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10019299
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Filing Dt:
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03/11/2002
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Title:
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UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE
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Assignees
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7-1, AKETA-CHO, TAKATSUKI-SHI |
OSAKA-FU, JAPAN |
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STRAWINSKYLAAN 3019 |
ATRIUM 1HG, AMSTERDAM, NETHERLANDS 1077 |
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Correspondence name and address
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JACOBSON HOLMAN PLLC
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WILLIAM E. PLAYER
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400 SEVENTH STREET, NW
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WASHINGTON, D.C. 20004-2218
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04/28/2024 09:49 AM
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