Patent Assignment Details
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| Reel/Frame: | 012952/0974 | |
| Pages: | 3 |
| | Recorded: | 06/03/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10103554
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Filing Dt:
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03/22/2002
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Publication #:
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Pub Dt:
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06/05/2003
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Title:
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Resist pattern thickening material, resist pattern and forming method thereof, and semiconductor device and manufacturing method thereof
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Assignee
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| NAKAHARA-KU, KAWASAKI-SHI |
| 1-1 KAMIKODANAKA 4-CHOME |
| KANAGAWA 211-8588, JAPAN |
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Correspondence name and address
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ARMSTRONG, WESTERMAN, & HATTORI LLP
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STEPHEN G. ADRIAN
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1725 K STREET NW
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SUITE 1000
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WASHINGTON, D.C. 20006
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