Patent Assignment Details
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| Reel/Frame: | 012977/0102 | |
| Pages: | 2 |
| | Recorded: | 06/10/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10103664
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Filing Dt:
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03/21/2002
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Publication #:
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Pub Dt:
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10/17/2002
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Title:
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LEAD FRAME AND SEMICONDUCTOR PACKAGE HAVING A GROOVE FORMED IN THE RESPECTIVE TERMINALS FIR LIMITING A PLATING AREA
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Assignee
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| 1-1, ICHIGAYA-KAGACHO 1-CHOME |
| SHINJUKU-KU, TOKYO 162-8001, JAPAN |
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Correspondence name and address
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FLYNN, THIEL, BOUTELL & TANIS
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DALE H. THIEL
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2026 RAMBLING ROAD
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KALAMAZOO, MI 49008-1699
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