Patent Assignment Details
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| Reel/Frame: | 013000/0240 | |
| Pages: | 2 |
| | Recorded: | 06/18/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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07/30/1991
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Application #:
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07451173
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Filing Dt:
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12/15/1989
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Title:
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CHIP-TYPE SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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08/25/1992
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Application #:
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07740888
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Filing Dt:
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08/06/1991
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Title:
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CHIP-TYPE SOLID ELECTROLYTIC CAPACITORS
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Patent #:
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Issue Dt:
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08/04/1992
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Application #:
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07754394
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Filing Dt:
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09/03/1991
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Title:
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PROCESS FOR MANUFACTURING A SOLID STATE ELECTROLYTIC CAPACITOR
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Patent #:
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Issue Dt:
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11/29/1994
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Application #:
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08022314
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Filing Dt:
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02/25/1993
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Title:
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ELECTRIC DOUBLE LAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 7-1, KORIYAMA 6-CHOME, TAIHAKU-KU |
| SENDAI-SHI, MIYAGI, JAPAN |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD.
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JEFFREY A. WYAND
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700 THIRTEENTH ST., N.W. SUITE 300
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WASHINGTON, D.C. 20005-3960
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