Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013002/0344 | |
| Pages: | 2 |
| | Recorded: | 06/14/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10170365
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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PACKAGING SUBSTRATE FOR ELECTRONIC ELEMENTS AND ELECTRONIC DEVICE HAVING PACKAGED STRUCTURE
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Assignee
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| 711, AZA SHARIDEN, OAZA KURITA |
| NAGANO-SHI NAGANO 380-0921, JAPAN |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: H. J. STAAS
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700 ELEVENTH STREET, N.W., SUITE 00
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WASHINGTON, D.C. 20001
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