Patent Assignment Details
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| Reel/Frame: | 013023/0743 | |
| Pages: | 3 |
| | Recorded: | 06/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10175071
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Filing Dt:
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06/19/2002
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Publication #:
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Pub Dt:
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12/25/2003
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Title:
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Electrostatic discharge protection scheme for flip-chip packaged integrated circuits
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 16, CREATION RD. 1, |
| HSIN CHU, TAIWAN ROC |
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Correspondence name and address
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NEEDLE & ROSENBERG, P.C.
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TIM TINGKANG XIA, ESQ.
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THE CANDLER BUILDING
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127 PEACHTREE STREET, N.E.
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ATLANTA, GEORGIA 30303-1811
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