Patent Assignment Details
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Reel/Frame: | 013032/0360 | |
| Pages: | 2 |
| | Recorded: | 06/24/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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10177111
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Filing Dt:
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06/24/2002
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Publication #:
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Pub Dt:
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01/16/2003
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Title:
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SEMICONDUCTOR WAFER DIVIDING METHOD
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Assignee
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14-3, HIGASHI KOJIYA 2-CHOME, OTA-KU |
TOKYO 144-8650, JAPAN |
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Correspondence name and address
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SMITH, GAMBRELL & RUSSELL, LLP
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MICHAEL A. MAKUCH
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1850 M STREET NW - SUITE 800
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WASHINGTON, D.C. 20036
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