Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013092/0123 | |
| Pages: | 2 |
| | Recorded: | 04/23/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/03/2006
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Application #:
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10111302
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Filing Dt:
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04/23/2002
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Publication #:
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Pub Dt:
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02/13/2003
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Title:
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Semiconductor joining substrate utilizing a tape with adhesive and copper-clad
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Assignee
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| 2-1 NIHONBASHI-MUROMACHI 2-CHOME, CHOU-KU |
| TOKYO 103-8666, JAPAN |
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Correspondence name and address
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MORRISON & FOERSTER LLP
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RAJ S. DAVE, PH.D., J.D.
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2000 PENNSYLVANIA AVENUE, N.W.
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WASHINGTON, D.C. 20006-1888
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