Patent Assignment Details
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| Reel/Frame: | 013098/0451 | |
| Pages: | 7 |
| | Recorded: | 07/10/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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10192736
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Filing Dt:
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07/10/2002
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Title:
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SEMICONDUCTOR PACKAGE WITH CIRCUIT SIDE POLYMER LAYER AND WAFER LEVEL FABRICATION METHOD
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Assignee
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| LEGAL DEPARTMENT, M/S 525 |
| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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THE LAW OFFICE OF STEPHEN A. GRATTON
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STEPHEN A. GRATTON
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2764 SOUTH BRAUN WAY
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LAKEWOOD, CO 80228
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