Patent Assignment Details
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| Reel/Frame: | 013107/0001 | |
| Pages: | 2 |
| | Recorded: | 07/17/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10196274
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Filing Dt:
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07/17/2002
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Publication #:
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Pub Dt:
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07/10/2003
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Title:
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APPARATUS AND METHOD FOR WAFER PATTERN INSPECTION
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Assignee
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| 24-14, NISHISHINBASHI, 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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REED SMITH, LLP
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STANLEY P. FISHER
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3100 FAIRVIEW PARK DR., STE. 1400
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FALLS CHURCH, VA 22042
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