Patent Assignment Details
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| Reel/Frame: | 013117/0771 | |
| Pages: | 4 |
| | Recorded: | 07/29/2002 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/29/1997
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Application #:
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08651833
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Filing Dt:
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05/21/1996
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Title:
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THERMALLY FUSED RESISTOR HAVING A PORTION OF A SOLDER LOOP THERMALLY CONNECTED TO AN ELECTRICALLY INSULATED PORTION OF AN OUTER SURFACE OF THE RESISTOR
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Assignee
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| 565 FIFTH AVENUE, FOURTH FLOOR |
| NEW YORK, NEW YORK 10017 |
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Correspondence name and address
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WOODARD, EMHARDT, NAUGHTON, ET AL.
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BRAD A. SCHEPERS
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BANK ONE CENTER/TOWER
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111 MONUMENT CIRCLE, SUITE 3700
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INDIANAPOLIS, INDIANA 46204-5137
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