Patent Assignment Details
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| Reel/Frame: | 013127/0658 | |
| Pages: | 3 |
| | Recorded: | 07/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/09/2004
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Application #:
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10197754
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Filing Dt:
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07/19/2002
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Publication #:
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Pub Dt:
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02/06/2003
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Title:
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METHOD OF GRINDING REAR SIDE OF SEMICONDUCTOR WAFER
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Assignee
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| 14-3, HIGASHI KOJIYA 2-CHOME, OTA-KU |
| TOKYO, 144-0033, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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CHARLES R. WATTS
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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