Patent Assignment Details
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| Reel/Frame: | 013141/0942 | |
| Pages: | 2 |
| | Recorded: | 07/25/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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10202992
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Filing Dt:
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07/25/2002
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Publication #:
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Pub Dt:
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01/29/2004
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Title:
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METHOD OF ETCHING A DIELECTRIC MATERIAL IN THE PRESENCE OF POLYSILICON
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 19 LI HSIN ROAD |
| HSIN CHU CITY, TAIWAN |
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Correspondence name and address
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MACPHERSON, KWOK, CHEN 7 HEID LLP
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ALAN H. MACPHERSON
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2402 MICHELSON DRIVE
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SUITE 210
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IRVINE, CA 92612
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