Patent Assignment Details
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Reel/Frame: | 013142/0134 | |
| Pages: | 2 |
| | Recorded: | 07/25/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/21/2004
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Application #:
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10202698
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Filing Dt:
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07/25/2002
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Publication #:
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Pub Dt:
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02/13/2003
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Title:
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HEATING FURNACE AND SEMICONDUCTOR WAFER-HOLDING JIG ASSEMBLY AND PROCESS OF MANUFACTURING SEMICONDUCTOR DEVICES
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Assignees
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2578-1, NOBORITO TAMA-KU |
KAWASAKI-CITY, KANAGAWA, JAPAN |
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SEC. 4, DA-AN DISTRICT |
11F, NO. 236, HSIN-YI RD. |
TAIPEI CITY, TAIWAN R.O.C |
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Correspondence name and address
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THOMAS, KAYDEN, HORSTEMEYER ET AL
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY, SUITE 1750
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ATLANTA, GA 30339-5948
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