Patent Assignment Details
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| Reel/Frame: | 013143/0178 | |
| Pages: | 3 |
| | Recorded: | 07/31/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/05/2004
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Application #:
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10140882
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Filing Dt:
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05/09/2002
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Publication #:
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Pub Dt:
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06/12/2003
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Title:
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COPPER PLATING BATH AND PLATING METHOD FOR SUBSTRATE USING THE COPPER PLATING BATH
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Assignees
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| YAMAGUCHI BLDG. #7 11TH FLOOR, 19-9, TAITO 4-CHOME, TAITO-KU |
| TOKYO 110-0016, JAPAN |
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO 144-8510, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: NILS E. PEDERSEN, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, D.C. 20006-1021
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