Patent Assignment Details
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| Reel/Frame: | 013145/0678 | |
| Pages: | 3 |
| | Recorded: | 05/24/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/19/2004
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Application #:
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10148014
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Filing Dt:
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05/24/2002
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Publication #:
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Pub Dt:
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12/05/2002
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Title:
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METHOD AND DEVICE FOR FLOW SOLDERING
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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MICHAEL S. HUPPERT
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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